Terms and Definitions


Chip Removal TT-65

TT-65 ThermoTweez
TT-65 ThermoTweez
Chip Components
Chip Components

1. Remove conformal coating (if any) and clean work of any contamination, oxides or residues.

2. Set a tip temperature of 343°C (650°F) for lead-free or 316°C (600°F) for leaded alloys and adjust as necessary.

3. Install and align Chip Removal tips into ThermoTweez®.

4. Apply flux to the component terminations. (A)

5. Clean any residue from tips with Fiber Tool from Tip Maintenance Station. (B)

6. Lower tips over component and gently tweeze handpiece contacting ALL solder joints. (C)

7. Confirm complete solder melt of ALL joints and lift component from PCB. (D) & (E)

8. Release component onto a heat resistant surface.

9. Return ThermoTweez® to its Tip & Tool Stand.

PACE SensaTemp® or Intelliheat® Power Supply
TT-65 ThermoTweez
Chip Removal Tip (See Tips/Nozzles Tab)
Tip Tool


Product Image Dimensions Part Number
A=0.76mm (0.03") 1121-0398-P1
A=2.0mm (0.08") 1121-0313-P1
A=4.1mm (0.16") 1121-0399-P1
A=6.4mm (0.25") 1121-0401-P1
A=2.0mm (0.08") 1121-0521-P1
A=0.43mm (0.017") 1121-0517-P1