Terms and Definitions


QFP Removal SX-100 Bridge Fill

SX-100 Sodr-X-Tractor
SX-100 Sodr-X-Tractor

1. Remove conformal coating (if any) and clean work of any contamination, oxides or residues.

2. Set a tip temperature of 343°C (650°F) for lead-free or 316°C (600°F) for leaded alloys and adjust as necessary.

3. Using the Mini-Wave® tip, Melt solder to form a solder bridge fill joining all component leads. (A)

4. Install TQFP removal Pik-Tip® and vacuum cup into the SX-100 using Tip Tool.

5. Remove old solder from TQFP removal Pik-Tip® with Fiber Tool from Tip Maintenance Station.

6. Thermal shock tip with damp Sponge Tool from Tip Maintenance Station.

8. Tin inside and bottom edges of tip with solder. (B)

9. Lower tip over component contacting ALL leads with tip. (C)

10. Confirm solder melt of ALL joints, apply vacuum and lift component from PCB. (D) & (E)

11. Release component from tip by wiping on a heat resistant surface.

12. Re-tin tip with solder and return the SX-100 to its Tip & Tool Stand.

13. Prepare lands for component replacement.

PACE SensaTemp® or Intelliheat® Power Supply
SX-100 Sodr-X-Tractor®
TQFP Removal Pik-Tip® (See Chart on Back)
PS-90 Universal Soldering Iron or TD-100 Thermo-Drive® Soldering Iron
Mini Wave® Tip
Tip Maintenance Station
Tip Tool
Flux-cored Solder
Product Image Dimensions Part Number
A X B - 8.7mm (0.344") x 8.7mm (0.344") 1121-0572-P1
A X B - 12mm (0.472") x 12mm (0.472") 1121-0573-P1
A X B - 12mm (0.472") x 12mm (0.472") 1121-0574-P1
A X B - 13.2mm (0.520") x 13.2mm (0.520") 1121-0575-P1
A X B - 15.3mm (0.604") x 15.3mm (0.604") 1121-0576-P1
A X B - 16.8mm (0.660") x 22.9mm (0.900") 1121-0603-P1
A X B: 21.6mm (0.850") x 21.6mm (0.850") 1121-0604-P1
A X B - 22.1mm (0.870") x 22.3mm (0.870") 1121-0605-P1