Terms and Definitions


SOIC Removal TT-65 Bridge Fill

TT-65 ThermoTweez
TT-65 ThermoTweez

1. Remove conformal coating (if any) and clean work of any contamination, oxides or residues.

2. Set a tip temperature of 343°C (650°F) for lead-free or 316°C (600°F) for leaded alloys and adjust as necessary.

3. Install SOIC Removal Tips into ThermoTweez using Tip Tool.

4. Place Fiber or Sponge Tool from Tip Maintenance Station between tips to align parallel and tighten set screws using Tip Tool. (A)

5. Melt solder to form a solder bridge fi ll joining all component leads using the PS-90 or TD-100 with Mini-Wave® Tip installed. (B)

6. Remove old solder from SOIC tips with Fiber Tool from Tip Maintenance Station.

7. Thermal shock tips with damp Sponge Tool from Tip Maintenance Station.

8. Tin bottom and inside edges of tips with solder. (C)

9. Lower tips over component and tweeze handpiece contacting ALL leads & with tips. (D)

10. Confirm solder melt of ALL joints and lift component from PCB. (D) & (E)

11. Release component from tips by wiping on a heat resistant surface.

12. Re-tin tips with solder and return ThermoTweez® to its Tip & Tool Stand.

13. Prepare lands for component replacement.

PACE SensaTemp® or Intelliheat® Power Supply
TT-65 ThermoTweez®
SOIC Removal Tips
PS-90 Universal Soldering Iron or TD-100 Thermo-Drive®
Soldering Iron
Mini-Wave® Tip
Tip Tool
Tip Maintenance Station
Flux-cored Solder
Product Image Dimensions Part Number
A=12.7mm (0.5") 1121-0473-P1
A=10.2mm (0.4") 1121-0514-P1
A=7.6mm (0.3") 1121-0512-P1
A = 25.4mm (1.0") 1121-0448-P1
A = 20.3mm (0.8") 1121-0497-P1
D=A=17.8mm (0.7") 1121-0416-P1