Terms and Definitions


TSOP Removal TD-100 Bridge

TD-100 Handpiece
TD-100 Handpiece

1. Remove conformal coating (if any) and clean work of any contamination, oxides or residues. 

2. Set a tip temperature of 343°C (650°F) for lead-free or 316°C (600°F) for leaded alloys and adjust as necessary. 

3. Install Mini-Wave® tip into the TD-100 using Tip Tool. 

4. Melt solder to form a solder bridge fill joining all component leads. (A)

5. Replace Mini-Wave® tip in the TD-100 with TSOP Removal Tip. 

6. Remove old solder from TSOP tip with Fiber Tool from Tip Maintenance Station. 

7. Thermal shock tip with damp Sponge Tool from Tip Maintenance Station. 

8. Tin bottom and inside edges of tip with solder. (B)

9. Lower tip over component contacting ALL leads with tip. (C)

10. Confirm solder melt of ALL joints and lift component from PCB. (D) & (E) (Surface tension of the tip should lift the component form the board. If this does not occur, use of tweezers to lift the component is optional) 

11. Release component from tip by wiping on a heat resistant surface. 

12. Re-tin tip with solder and return the TD-100 to its Tip & Tool Stand. 

13. Prepare lands for component replacement. 

PACE Intelliheat® Power Supply 

TD-100 Thermo-Drive® Soldering Iron 

TSOP Removal Tip (See Chart on Back) 

Mini-Wave® Tip 

Tip Tool 


Tip Maintenance Station


Flux-cored Solder 


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