Non-Destructive Component Removal

Terms and Definitions

The particular process goals and guidelines for non-destructive component removal are as follows:

Surface Mount Components

  • Pre-/auxiliary heat assembly and/or component if required
  • Evenly apply heat in a rapid, controllable fashion to achieve complete, simultaneous reflow (melt) of all solder joints
  • Avoid thermal and/or mechanical damage to component, board, adjacent components and their joints
  • Immediately remove component from board before any solder joint re-solidifies
  • Prepare lands for replacement component

Thru-hole Components

Desoldering component one joint at a time using continuous vacuum method

  • Pre-/auxiliary heat assembly and/or component if required
  • Heat joint in a rapid, controllable fashion to achieve complete solder reflow
  • Avoid thermal and/or mechanical damage to component, board, adjacent components and their joints
  • Apply vacuum during lead movement to cool joint and free lead
  • Desoldering component using solder fountain method
  • Reflow all joints in solder fountain
  • Remove old component and either immediately replace with new component, or clear thru-holes for component replacement later