TF2800 BGA and SMD Rework System

TF2800 BGA and SMD Rework System

Conventional resistance coil heating technology has been successfully used in convective rework stations for decades to install and remove a variety of BGA, QFN, CSP, CGA, PoP, Flip Chip, 0201 and other bottom terminated components. However, today’s extremely high thermal mass boards, ultra-fine pitch components and challenging production rework environments demand greater process control, thermal performance and faster throughput than ever before.

Enter PACE’s TF 2800 BGA/SMD Rework System. With its groundbreaking, patented Inductive-Convection Heating Technology, the TF 2800’s top-side heater reaches the target temperature in just seconds for safe, rapid solder joint reflow in virtually any component installation or removal application.

  • Features
    Ultra-Precise 28µm Placement Accuracy
    Revolutionary Inductive-Convection Heater
    Active Cooling Through Nozzle Provides Rapid Solder Cooldown
    4 Thermocouple Inputs
    Adjustable Height Bottom-Side IR Preheater
    Board Support Beam
    Precision 24" x 24" PCB Holder
    Auxiliary Cooling Fan
    Motorized, High-Def (1080p) Optical Alignment System with Quad-Field Imaging
    Single-Axis Operation
    Windows 10 Micro PC with 24" LCB Monitor
    Operator-Friendly Software Suite
    Made in the USA
  • Specifications
    Power Requirements
    120 VAC, 50-60Hz (requires 20 A supply)|| 230 VAC, 50-60Hz (requires 10 A supply); 1600W maximum
    737mm (29") H x 1118mm (44") W x 965mm (38") D
    Weight (Without Computer)
    90kg (200lbs)
    Top-side Heater
    Inductive-Convection Heater, 300 Watts
    Bottom Side Heater
    Medium/Long wave IR, 1900 Watts; 405mm (16") x 405mm (16") || (1 x 1000 Watts & 6 x 150 Watts)
    Bottom Heater Adjustable Height
    Can be raised up to 38mm (1.5") closer to the PCB
    Active Cooling Capability
    Offers swift, yet controlled component/PCB cooling, directly through the nozzle
    High Sensitivity Vacuum Pick
    Counterweight balanced with an optical sensor and precision high temperature linear ball bearings (includes 7 picks)
    Precision Placement Capability
    Placement system utilizes a stepper motor and position encoding for precise movement
    Placement Accuracy
    28μm (.0011") accuracy
    Integrated Board Support Beam
    2 standard supports, 1 x support wand & 1 x fixed center height adjustment, prevents PCBs from sagging or warping during rework and is extremely adjustable to clear parts on bottom of PCB.
    Temperature Setting Range
    Top Heater: 100˚ to 328˚C (212˚ - 624˚F); Bottom Heater: 100˚ to 221˚C (212˚ - 430˚F)
    Max PCB Size
    Maximum: 610mm x 610mm (24" x 24"); Minimum: N/A arms close down completely
    Max/Min Component Size
    Maximum: 65mm (2.5") x 65mm (2.5"); Minimum: 1mm Sq.
    Thermocouple Inputs
    Four (4) thermocouple inputs insure accurate profile development and real-time monitoring (includes 2 K-type thermocouples)
    High Definition Optical Alignment
    Vision Overlay System (VOS) with High Definition 1080p color camera
    Vision Overlay System (VOS)
    Contains integrated frame grabber and dichroic beam-splitting prism with independantly controlled LED lighting
    VOS Zoom Capability
    Up to 240x zoom capability, with Stable Zoom and image stabilization
    Quad-Field Imaging
    Allows up to four opposite corners of a large component (and its pads) to be viewed under higher magnification
    Single Axis Operation
    All operations are complete in a single axis, eliminating risk of component movement after placement/reflow
    Auxiliary Cooling Fan
    Intuitive, user-friendly, Windows software guides operators through profile development and execution
    Computer System
    Windows 10 PC, with wireless mouse and keyboard
    Video Monitor
    607mm (24") wide screen flat panel monitor (includes Monitor Arm Mounting Kit)
    Maximum Airflow
    Self contained pump, PC controlled, adjustable up to 30 SLPM
    Component Nests
    Two (2) removable and adjustable Component Nests provided for perfect centering of components, in preparation for vacuum pick-up/placement. Unique component holding system for parts under 5mm Sq.
    Heat Focusing, Vented Nozzles
    Over 90 nozzles available
    Flux Application Plate
    Included; allows for automated flux dipping
    Stencils/Solder Paste Application
    Over 145 stencil kits are optionally available (requires Universal Bracket Kit) and are integrated into the installation process
    PV-65 Pik-Vac Vacuum Wand
    Included; provides a manual vacuum pick-up capability for handling SMDs, with 15 minute auto-off feature
    One Year Limited Warranty
  • More Information

    Top-Side Heater: Fast Heat Up - Rapid Cool Down

    TF 1800 Inductive-Convection Chart
    PACE’s Inductive-Convection Heater easily outperforms competitive heaters which utilize standard forced air convection technology, achieving target temperature instantaneously, about 4x faster than competitive heaters. Unlike conventional heaters, the TF 2800 immediately drops to temperatures well below solder melt when the heater is de-energized (results shown for TF 1800 Heater).



    How Inductive-Convection Heating Works

    The TF 2800’s patented Inductive-Convection Heating Technology provides ultimate thermal performance by its ability to instantly heat up and cool down the temperature of the air it delivers to the work.

    inductive heaters
    1.) The air is first pre-heated in the outer heater chamber as it moves in a cyclonic fashion around the induction coil before it enters the inner chamber.  2.) After entering the inner chamber, the pre-heated air is then heated to target temperature through a highly efficient heat transfer process in an energized induction field. 3.) During active cooling, the induction coil is de-energized and the TF 2800 delivers fast, controlled, active cooling of the component and PCB directly through the nozzle, eliminating the risk of excessive intermetallic growth and yielding the highest quality solder joints.

    Powerful, Energy Efficient Performance

    The TF 2800’s Inductive-Convection Heating Technology delivers all the power you need to tackle the most challenging high thermal mass PCBs available today. Yet, its highly-efficient design does it with just a fraction of the power required by yesterday’s conventional heating technology.

    Advanced Features

    TF2800 Infographic
    TF1800-BGA-SMD-Rework_placementUltra-High Precision Placement Capability
    Newly designed motorized reflow head is driven by an advanced stepper motor system which provides smooth, high precision, repeatable movement with no drift, allowing for soft landing of components and 28µm (.0011") placement accuracy.



    TF1800-BGA-SMD-Rework_PickHigh Sensitivity Vacuum Pick Assembly
    New Vacuum Pick design is more robust, utilizes an optical sensor, is counterweight balanced, and uses precision high temperature linear ball bearings for the highest sensitivity in placement and pick-up. Includes 7 Vacuum Picks.



    TF2800 Bottom-side preheaterPACE Exclusive Height Adjustable Bottom-Side Preheater
    An array of 7 high powered IR emitters respond to high mass assemblies faster with 1900W of power. Preheater height is adjustable from standard position up to 38mm (1.5") closer to the PCB for the most challenging high thermal mass boards.



    TF2800 Vision Overlay System & CameraHigh-Definition Optical Alignment System
    An automated Vision Overlay System uses a beam-splitting prism for simultaneous view of PCB pads and balls, high intensity LEDs for shadow-free lighting, and new high definition 1080p camera to easily align any component.



    TF2800 Alignment ScreenCrisp & Clear Images for Component Alignment
    A high definition Vision Overlay System uses bright white LEDs with independent intensity control and up to 240x zoom capability to provide precise distinction of pads and solder ball or leads.



    TF2800 Quad Field ImagingQuad-Field Imaging for Large/Fine Pitch BGA's
    Quad-Field Imaging allows up to four corners of a large component (and its pads) to be viewed under high magnification, providing perfect alignment of outsized BGAs or fine-pitch QFPs.



    TF2800 Software ScreenFourth Generation Software Suite
    Newly designed Windows-based software provides a simple graphical interface with intuitive set-up and profiling, on-the-fly profile adjustment, unlimited profile storage and much more.





  • Resources
  • Manuals
    TF 1800 & TF 2800 BGA Rework Systems Manual
  • Brochures
    TF 2800 Info Sheet
    TF 1800 & TF 2800 BGA Rework Systems Brochure
  • Additional Videos